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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-421-2

International Heat Transfer Conference 15
August, 10-15, 2014, Kyoto, Japan

Electronic Equipment Cooling

Table of Contents:

Transient Thermal Behavior of The Microprocessor System - Investigation of Effects by Distributed Thermal Capacitance and Thermal Spreading Resistances Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka pages 1903-1915 DOI: 10.1615/IHTC15.eec.008910
AN 1-D Model for Species Crossover Through the Membrane in All-Vanadium Redox Flow Batteries Yuan G. Lei, Baowen Zhang, Bofeng Bai, Tianshou Zhao pages 1917-1928 DOI: 10.1615/IHTC15.eec.008951
A Miniature Multiple Vibrating-Fan Cooling System Using Magnetic Force and Piezoelectric Force HsienChin Su, Chun Lin Liu pages 1929-1940 DOI: 10.1615/IHTC15.eec.008327
Liquid Film Wave Patterns and Dryout in Microgap Channel Annular Flow Caleb A. Holloway, Avram Bar-Cohen, Darin J. Sharar pages 1941-1955 DOI: 10.1615/IHTC15.eec.009808
Conjugate Forced Convection-Conduction Heat Transfer in Channel Flow Using Different Cooling Fluids Felipe Baptista Nishida, Yara de Souza Tadano, Thiago Antonini Alves pages 1957-1970 DOI: 10.1615/IHTC15.eec.009594
Development of In-plane Thermal Conductivity Measurement Method of Multi-layer Printed Wiring Boards Called Straight Fin Temperature Fitting Method Tetsuro Ogushi, Kumi Aoki, Takashi Kobayashi, Yuta Niki, Takuya Hirata pages 1971-1985 DOI: 10.1615/IHTC15.eec.009396
L-Shaped Thermosyphon Loop with Vertical Evaporator for Power Electronics Cooling Francesco Agostini, Thomas B. Grandinger pages 1987-1996 DOI: 10.1615/IHTC15.eec.008546
Performance Evaluation of Micro-Jet Impingement on Various Dimpled Surfaces Sun-Min Kim, Kwang-Yong Kim pages 1997-2003 DOI: 10.1615/IHTC15.eec.009420
The Forced Circulation Cooling System with Rectangular Mini-Channels for the Inverter of Electric Vehicles Jiwon Yeo, Daisuke Jige, Seiya Yamashita, Shigeru Koyama pages 2005-2018 DOI: 10.1615/IHTC15.eec.009166
Practical Measurement System for Very-Large-Scale Integration Circuits Using Infrared Thermography Yuan-Ta Hsieh, Jian-Fu Wu, Chiao-Li Fang, Hann-Huei Tsai, Ying-Zong Juang pages 2019-2026 DOI: 10.1615/IHTC15.eec.009936
Heat Transfer and Fluid Mechanics from a Piezoelectric Fan Operating in Its Second Resonant Frequency Mode Nicholas Jeffers, Jason Stafford, Brian Donnelly pages 2027-2039 DOI: 10.1615/IHTC15.eec.009227
Convolution Based Steady State Compact Thermal Model for 3D-Integrated Circuits: Methodology for Including the Thermal Impact of Die to Die Interconnections Federica Lidia Teresa Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans pages 2041-2054 DOI: 10.1615/IHTC15.eec.009115