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International Heat Transfer Conference 15

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

Conjugate Forced Convection-Conduction Heat Transfer in Channel Flow Using Different Cooling Fluids

Felipe Baptista Nishida
Federal University of Technology – Paraná

Yara de Souza Tadano
Federal University of Technology – Paraná

Thiago Antonini Alves
Paulist State University − Unesp, Ilha Solteira, SP, Brazil, Federal University of Technology - Parana

DOI: 10.1615/IHTC15.eec.009594
pages 1957-1970


KEY WORDS: Electronic equipment cooling, Heat transfer enhancement, conjugate heat transfer, forced convection, conduction, laminar flow, 3D protruding heaters

Abstract

A numerical analysis was performed to investigate the heat transfer and the fluid flow around threedimensional protruding heaters mounted on the bottom wall (substrate) of a horizontal rectangular channel using the ANSYS/FluentTM 15.0 software. Two different cooling fluids were analyzed; the air and the NovecTM 7500, a dielectric fluid with low global warming potential. Uniform heat generation rate was considered for the 3D protruding heaters and the cooling process happened through a steady laminar flow, with constant properties. The fluid flow velocity and temperature profiles were uniform at the channel entrance. For the adiabatic substrate, the cooling process occurred exclusively by forced convection. For the conductive substrate (printed circuit board), the cooling process was characterized by conjugate forced convection-conduction heat transfer through two mechanisms; one directly between the heaters surfaces and the flow by forced convection, and the other through conduction at the interfaces heater-substrate in addition to forced convection from the substrate to the fluid flow at the substrate surface. The governing equations and boundary conditions were numerically solved through a coupled procedure using the Control Volumes Method in a single domain comprising the solid and fluid regions. Commonly used properties in cooling of components mounted in a PCB and typical geometry dimensions were utilized in the results acquisition. An investigation was done on the effects of the Reynolds numbers. The fluid flow behavior around the 3D protruding heaters was shown with streamlines. The thermo-fluid-dynamic parameters of interest were gathered for distinct cases analyzed and also compared, when possible, with the available results in the literature. The dielectric fluid NovecTM 7500 has a superior thermal conductance than the air. The cooling process of the 3D protruding heaters was improved by the conjugate forced convectionconduction heat transfer, independently of the cooling fluid studied.

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