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Início Arquivos Thermal Letter Representantes Futuras reuniões Assembléia das Conferências Internacionais de Transferência de Calor
International Heat Transfer Conference 15

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

Electronic Equipment Cooling


Transient Thermal Behavior of The Microprocessor System - Investigation of Effects by Distributed Thermal Capacitance and Thermal Spreading Resistances
Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
pages 1903-1915
DOI: 10.1615/IHTC15.eec.008910
AN 1-D Model for Species Crossover Through the Membrane in All-Vanadium Redox Flow Batteries
Yuan G. Lei, Baowen Zhang, Bo-Feng Bai, Tianshou Zhao
pages 1917-1928
DOI: 10.1615/IHTC15.eec.008951
A Miniature Multiple Vibrating-Fan Cooling System Using Magnetic Force and Piezoelectric Force
HsienChin Su, Chun Lin Liu
pages 1929-1940
DOI: 10.1615/IHTC15.eec.008327
Liquid Film Wave Patterns and Dryout in Microgap Channel Annular Flow
Caleb A. Holloway, Avram Bar-Cohen, Darin Sharar
pages 1941-1955
DOI: 10.1615/IHTC15.eec.009808
Conjugate Forced Convection-Conduction Heat Transfer in Channel Flow Using Different Cooling Fluids
Felipe Baptista Nishida, Yara de Souza Tadano, Thiago Antonini Alves
pages 1957-1970
DOI: 10.1615/IHTC15.eec.009594
Development of In-plane Thermal Conductivity Measurement Method of Multi-layer Printed Wiring Boards Called Straight Fin Temperature Fitting Method
Tetsuro Ogushi, Kumi Aoki, Takashi Kobayashi, Yuta Niki, Takuya Hirata
pages 1971-1985
DOI: 10.1615/IHTC15.eec.009396
L-Shaped Thermosyphon Loop with Vertical Evaporator for Power Electronics Cooling
Francesco Agostini, Thomas B. Grandinger
pages 1987-1996
DOI: 10.1615/IHTC15.eec.008546
Performance Evaluation of Micro-Jet Impingement on Various Dimpled Surfaces
Sun-Min Kim, Kwang-Yong Kim
pages 1997-2003
DOI: 10.1615/IHTC15.eec.009420
The Forced Circulation Cooling System with Rectangular Mini-Channels for the Inverter of Electric Vehicles
Jiwon Yeo, Daisuke Jige, Seiya Yamashita, Shigeru Koyama
pages 2005-2018
DOI: 10.1615/IHTC15.eec.009166
Practical Measurement System for Very-Large-Scale Integration Circuits Using Infrared Thermography
Yuan-Ta Hsieh, Jian-Fu Wu, Chiao-Li Fang, Hann-Huei Tsai, Ying-Zong Juang
pages 2019-2026
DOI: 10.1615/IHTC15.eec.009936
Heat Transfer and Fluid Mechanics from a Piezoelectric Fan Operating in Its Second Resonant Frequency Mode
Nicholas Jeffers, Jason Stafford, Brian Donnelly
pages 2027-2039
DOI: 10.1615/IHTC15.eec.009227
Convolution Based Steady State Compact Thermal Model for 3D-Integrated Circuits: Methodology for Including the Thermal Impact of Die to Die Interconnections
Federica Lidia Teresa Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans
pages 2041-2054
DOI: 10.1615/IHTC15.eec.009115