ISSN Online: 2377-424X
ISBN Print: 0-89116-909-1
International Heat Transfer Conference 9
THE INFLUENCE OF SUBCOOLING ON THE POOL NUCLEATE BOILING AND CRITICAL HEAT FLUX OF SIMULATED ELECTRONIC CHIPS
Sinopsis
Three commercially available enhanced boiling surfaces (Union Carbide High Flux, Hitachi Thermoexcel−E, and Wieland GEWA−T) and a smooth copper surface were used to reduce the wall superheat and increase the critical heat flux (CHF) of 5mm × 5mm simulated electronic chips. Experiments were performed in a pool of FC−72 at atmospheric pressure under saturated and sub-cooled conditions; the subcooling range was 0−31° C. It was found that particular combinations of enhanced surface and subcooling can provide the heat removal capability required for future high flux chips. Heat fluxes higher than 106W/m2 were obtained. Insight into the influence of subcooling on pool nucleate boiling and CHF is gained.