ISSN Online: 2377-424X
ISBN Print: 978-1-56700-421-2
International Heat Transfer Conference 15
Heat Transfer Analysis of Aluminum Honeycomb Panels Incorporating Microencapsulated PCM
Abstrakt
This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste*=2-5 and Sc*=0.24-0.32 was proposed.