ISSN Online: 2377-424X
ISBN Print: 0-89116-909-1
International Heat Transfer Conference 9
Cooling Of Electronic Equipment
Table of Contents:
THE INFLUENCE OF SUBCOOLING ON THE POOL NUCLEATE BOILING AND CRITICAL HEAT FLUX OF SIMULATED ELECTRONIC CHIPS
pages 289-294
DOI: 10.1615/IHTC9.450
THERMAL MANAGEMENT OF HIGH-POWER TAB 1С CHIPS INCORPORATING HEAT SPREADERS AND HEAT PIPES
pages 295-300
DOI: 10.1615/IHTC9.460
OPTIMISATION OF FORCED CONVECTION COOLED ELECTRONIC SYSTEMS: AN EXPERIMENTAL STUDY
pages 307-312
DOI: 10.1615/IHTC9.480
AN ALTERNATIVE METHODOLOGY FOR COMPUTING THE TEMPERATURE RISE OF AN ELECTRONIC DEVICE INSIDE A DIRECT AIR-COOLED ELECTRONIC CABINET
pages 313-318
DOI: 10.1615/IHTC9.490
APPROXIMATE THERMAL PACKAGING LIMIT FOR HYBRID SUPERCONDUCTOR-SEMICONDUCTOR ELECTRONIC CIRCUITS
pages 319-324
DOI: 10.1615/IHTC9.500
TURBULENT THREE-DIMENSIONAL HEAT TRANSFER ANALYSIS OF ARRAYS OF HEATED BLOCKS
pages 331-336
DOI: 10.1615/IHTC9.520
EXPERIMENTS ON BOILING INCIPIENCE WITH A HIGHLY-WETTING DIELECTRIC FLUID; EFFECTS OF PRESSURE, SUBCOOLING AND DISSOLVED GAS CONTENT
pages 337-342
DOI: 10.1615/IHTC9.530
NATURAL CONVECTION COOLING OF AN ELECTRONIC COMPONENT IN A SLOT
pages 343-348
DOI: 10.1615/IHTC9.540