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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

NUMERICAL SIMULATION OF HEAT TRANSFER ENHANCEMENT FOR COPPER FOAM HEAT SINK IN ELECTRONIC DEVICES USING WATER BASED BN NANOFLUIDS

Get access (open in a dialog) DOI: 10.1615/IHTC16.ctm.023451
pages 3795-3802

Аннотация

The present work aims to increase the cooling rate in electronic devices by enhancing the heat transfer with BN/water nanofluids in copper foam heat sink. Atwo-step method has been followed to formulate BN/water nanofluids. The concentration of the nanofluids used in the test rig is 0.5 wt.%. The thermal conductivity and viscosity of the nanofluids have been measured to study the effect on the heat transfer in the heat sink and the pressure drop through the heat sink. The measured values have been used in the numerical simulation to obtain the heat transfer and pressure drops of the system comparing the performance with water as the working fluid. It has been found that there is a significant enhancement when using the copper foam and BN/DI water nanofluids.