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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

LOW MELTING POINT METAL ENABLED PCM HEAT SINK AGAINST HIGH HEAT FLUX THERMAL SHOCK

Get access (open in a dialog) DOI: 10.1615/IHTC16.ctm.022097
pages 3889-3894

Аннотация

In this paper, an internally finned PCM thermal buffering module based on a low melting point metal, gallium, is developed and numerically investigated. Thermal responses of the module under high thermal shock conditions (e.g. 100 W, 25 W/cm2) are studied, in comparison with that of a conventional paraffin PCM. The main parameters characterizing the module, including thermal resistance and temperature rise rate during melting, are evaluated, and corresponding correlations are provided for guiding practical thermal design. Periodic thermal performance of the module under given convection cooling condition is investigated and compared with the case without PCM. The developed low melting point metal based PCM module shows excellent thermal control performance in coping with high heat flux thermal shocks, which is very difficult to handle by conventional organic PCMs.