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ISSN Online: 2377-424X

ISBN Print: 1-56032-797-9

International Heat Transfer Conference 11
August, 23-28, 1998, Kyongju, Korea

APPLICATION OF THE THERMAL NETWORK METHOD TO THE TRANSIENT THERMAL ANALYSIS OF MULTICHIP MODULES

Get access (open in a dialog) DOI: 10.1615/IHTC11.200
pages 117-122

Аннотация

In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex and its treatment is tedious and time consuming.
This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. Based on the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model are confirmed.