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ISSN Online: 2377-424X

ISBN Print: 0-85295-345-3

International Heat Transfer Conference 10
August, 14-18, 1994, Brighton, UK

DEVELOPMENT OF HIGH PERFORMANCE AIR COOLING HEAT SINK UTILIZING PIN-FINS

Get access (open in a dialog) DOI: 10.1615/IHTC10.420
pages 87-92

Аннотация

A high-performance air cooling heat sink for large-scale integrated circuits (LSIs) utilizing pin-fins was developed. The heat sink consisting of a pin array was constructed by arranging slit-plates and spacers alternately. An etching technique was used in making the slit-plates which formed the row of very thin pins (0.2 mm). In order to evaluate the heat transfer and pressure loss characteristics of the pin-fin array, heat transfer and flow visualization tests were conducted by varying the geometrical properties systematically as parameters. From the test results, heat transfer performance of pin-fin arrays was clarified and a heat sink for LSIs was designed. It has been found that the pin-fin arrays have noticeably high performance concerning the heat dissipation ability per unit volume of heat sink compared to conventional heat sinks.