ISSN Online: 2377-424X
ISBN Print: 0-85295-345-3
International Heat Transfer Conference 10
NEW METHOD OF AUGMENTATION OF HEAT TRANSFER ON THE SURFACES OF POWER SEMICONDUCTOR DEVICES COOLERS
Аннотация
The problem of cooling power semiconductor devices (thiristors and diodes) is one of the most important problems of present day power engineering. This problem is successfully solved by using advanced methods of heat transfer augmentation.
This report describes the results of the work aimed at increasing the efficiency of individual coolers of power semiconductor devices designed on the basis of heat pipes with a plate-type-finned condenser section. The coolers efficiency of is increased by means of vortex augmentation of heat transfer to the condenser fins which is caused by a regular system of spherical cavities on their surfaces. The experimental and numerical results are presented.
This report describes the results of the work aimed at increasing the efficiency of individual coolers of power semiconductor devices designed on the basis of heat pipes with a plate-type-finned condenser section. The coolers efficiency of is increased by means of vortex augmentation of heat transfer to the condenser fins which is caused by a regular system of spherical cavities on their surfaces. The experimental and numerical results are presented.