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ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

COOLING OF ELECTRONIC CHIPS IN LIQUID NITROGEN

Get access (open in a dialog) DOI: 10.1615/IHTC9.470
pages 301-306

Аннотация

High-performance electronic components increasingly require special cooling techniques to remove high-density power dissipations from microelectronic chips. Operations at cryogenic temperatures can reduce thermal energy generation and dissipation requirement. Furthermore, direct immersion cooling in cryogenic nitrogen can potentially increase heat removal intensity.
The present study investigates nucleate boiling heat transfer from a small vertical surface to two-phase nitrogen. Experiments were performed both with forced flow and with buoyancy-induced circulation.
Two sets of experiments were carried out with different heat source geometries. Experimental data obtained with both forced and natural circulation flows showed good agreement, higher peak-heat-fluxes, however, were obtained with forced flow.