Inscrição na biblioteca: Guest

ISSN Online: 2377-424X

ISBN Print: 0-89116-130-9

International Heat Transfer Conference 6
August, 7-11, 1978, Toronto, Canada

FULL THERMAL INVESTIGATION OF THE INTEGRATED CIRCUIT μA726

Get access (open in a dialog) DOI: 10.1615/IHTC6.2910
pages 191-195

Resumo

A full thermal investigation of the Temperature Stabilized Substrate Integrated Circuit (TSS IC) μA726 has been performed using a new and accurate quasi-three dimensional numerical method. This new method allows a reduction of the three-dimensional thermal problem to a bidimensional one. This reduction do not affect the accuracy of the computed temperature distribution of the semiconductor chip. The validity of our approach was checked experimentally. A good agreement was found between theoretical and experimental data. This method, tested in complete and interactive electrical and thermal analysis of TSS IC μA726 is of a general validity, beeing a valuable tool in electrothermal analysis of other integrated circuits(ICS).