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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

REDUCTION OF AN ELECTRONIC CARD THERMAL PROBLEM BY THE MODAL SUB STRUCTURING METHOD

Get access (open in a dialog) DOI: 10.1615/IHTC16.cms.022515
pages 1899-1906

要約

The computation time needed to compute modes remains the main drawback of modal methods. This computation time can be reduced by using the sub structuring modal method. First of all, the model is divided into elementary entities, and modes of each entity are independently computed. In order to solve the original problem, only specific modes are chosen to couple sub-structures together : the Steklov modes. This method is applied to an electronic card witch supports eighteen components. The Printed Circuit Board is accurately modeled considering local thermal properties (like local copper tracks). The reduced model recovers the maximum temperature of critical component for a dynamic scenario and various boundary conditions reducing the solver time by 500.