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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

TEMPERATURE DISCONTINUITY AND RESISTANCE AT THE LIQUID−GAS INTERFACE OF THIN LIQUID FILM AND DROPLET UNDER HEATING

Get access (open in a dialog) DOI: 10.1615/IHTC16.bae.024310
pages 1479-1484

要約

The rapid development, miniaturization, and increase in the power density of electronics places to greater emphasis on the performance and limits of today's thermal management solutions. Of great interest to engineers and researchers is the possibility of using ultrahigh-intensity evaporation of thin liquid films. The transition between the continuum and molecular scales for a continuous description of phase transition is still an open challenge. We present new data on measurements of the temperature profile across the liquid−gas interface of a heated thin liquid film and small-sized droplet for different fluids. Microthermocouple with the sensor thickness less than 3 µm is used for measurements. A temperature jump at the liquid-gas interface was clearly detected even for small evaporation rate. This jump was measured for heater temperature varying in the range 23 − 80 ° C at normal atmospheric conditions. We found the increasing of the temperature jump with increasing of the heat flux and evaporation rate. An evolution of the temperature profile with increasing of the heater temperature is obtained. Depending on the ambient condition and type of fluids, the temperature in the gas phase near the liquid-gas interface can be higher or lower than that of the liquid. The temperature profiles with negligible temperature jump at liquid-gas interface are observed for some operating conditions. Finally, we estimate the thermal resistance of thin liquid film and droplet, which is useful for cooling systems such as micro-sized vapor chamber.