ライブラリ登録: Guest

ISSN Online: 2377-424X

ISBN Print: 978-1-56700-421-2

International Heat Transfer Conference 15
August, 10-15, 2014, Kyoto, Japan

Study on Heat Transfer Characteristics of Miniature/Micro Pins

Get access (open in a dialog) DOI: 10.1615/IHTC15.tmg.009032
pages 8151-8160

要約

In the present study, the effects of pin size, pin arrangement and pin shape on the heat transfer characteristics of heat sinks with miniature/micro pins have been investigated fundamentally. Six types of heat sink models are investigated in this paper. Concerning these six heat sinks, the effects of pin arrangement (aligned or staggered) and pin shape (square or circle pillar) set in the sideward facing of the heated surface on their heat transfer performance have been studied experimentally and theoretically. From a series of experiments and numerical simulations, it has been clarified that the heat sink temperature rises with the increase in the number of pins under the constant whole heat transfer area. That is, contrary to expectations, the heat sink with miniaturized fine pins showed almost no effect on the heat transfer enhancement. This is because of the choking phenomenon occurred in the air space among the pin fins. Concerning the effects of pin arrangement and pin shape on the heat sink performance, almost a similar tendency has been observed.