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ISSN Online: 2377-424X

ISBN Print: 0-85295-345-3

International Heat Transfer Conference 10
August, 14-18, 1994, Brighton, UK

TEMPERATURE DISTRIBUTION IN A CONDUCTING MEDIUM DUE TO A HELICAL HEAT SOURCE

Get access (open in a dialog) DOI: 10.1615/IHTC10.860
pages 415-419

要約

Some of the circuit elements that are used in electronic circuits can be modeled as helices wound on the surface of a cylinder or cone. When electrical current flows through them, there is ohmic heat loss. The steady state temperature distribution due to one such source of heat in a conducting medium is studied by modeling it as a helix wound on the surface of a cone and then applying the integral formulation of the steady state heat conduction equation. The steady state temperature distributions due to a heat source in the shape of a conical helix and spiral are studied for different geometrical parameters. These results might be useful in the thermal analysis and design of cooling systems for electronic circuits.