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International Heat Transfer Conference 16

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

SIGE-BASED PLANAR THERMOELECTRIC THIN FILM MICRO REFRIGERATORS

Yu Su
Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

Baoling Huang
Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong; The Hong Kong University of Science and Technology Shenzhen Research Institute, Shenzhen, China

DOI: 10.1615/IHTC16.rac.023197
pages 8507-8515


MOTS CLÉS: Thermoelectric devices, NEMS/MEMS, SiGe, on-chip cooling

Résumé

The continuous improvement of microelectronic devices' performance in recent days have resulted in great challenges in thermal management. Thermoelectric microrefrigerators stand out from other traditional cooling methods such as air or liquid forced cooling, metal heatsink and heat pipe cooling due to its all solidstate, high reliability, low noise level, quick response, cooling ability below ambient and scalable property. Besides toxic problem, conventional microrefrigerators based on heavy metal elements such as Bi2Te3 are generally incompatible with microelectronic fabrication process and are therefore challenging for on-chip integration. In this work, we demonstrate the single-stage and two-stage thermoelectric microrefrigerators based on nanograined SiGe thin films in planar configuration with the total dimension of 420×420 μm2 and 860×860 μm2 respectively. After optimization of thin film properties, adjustment of structure design and contact property improvement, maximum cooling temperatures of 9.3 K and 11.2 K have been achieved by the single-stage and two-stage microrefrigerators respectively with power consumption less than 1 mW.

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