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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

ENHANCED INTERFACIAL HEAT TRANSFER OF LIQUID METAL ALLOY ON COPPER PLATE BY INTRODUCING MO BUFFER LAYER

Get access (open in a dialog) DOI: 10.1615/IHTC16.hte.023704
pages 5349-5356

Résumé

Modification of the copper surfaces by coating metals is an effective way to improve the wettability and interface bonding between copper plate and liquid metal alloy (LMA). In current work, a continuous Mo buffer layer was formed on copper surfaces by DC magnetron sputtering. The LMA of Ga62.5In21.5Sn16 was used as thermal interface material (TIM) to sandwich Mo-coated copper plates together. The structure and wettability of Mo-coated plate were characterized by X-ray diffractometer and Drop shape analyzer. The peaks of Mo and Cu are observed in the XRD pattern, no other compounds are detected. The contact angles of water on copper plate and Mo-coated copper plate are 65.9° and 17.8° respectively, which shows that the wettability of the Mo-coated copper plate is better than the copper plate. Samples were fabricated to test the effects of the LMA and Mo layer on the thermal properties. The thermal contact resistance of sample Cu-Cu is 937.095 mm2K/W with a thermal conductivity of 3.596 W/mK. The thermal contact resistance of sample Cu-LMA-Cu is 1.119 mm2K/W with a thermal conductivity of 350.356 W/mK. The sample with Mo layer exhibits thermal contact resistance as low as 0.616 mm2K/W with a thermal conductivity of 369.484 W/mK. After wettability modification by coating Mo layer, the thermal contact resistance decreases by about 45%. This indicates that Mo buffer layer plays a critical role in enhancing the thermal transfer at LMA/Cu interface region.