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ISSN Online: 2377-424X

ISBN Print: 0-89116-559-2

International Heat Transfer Conference 8
August, 17-22, 1986, San Francisco, USA

THERMAL FIELD PREDICTION IN ELECTRONIC EQUIPMENT

Get access (open in a dialog) DOI: 10.1615/IHTC8.4370
pages 2983-2988

Résumé

A 3 step development program has been elaborated to create a new and accurate method for predicting air flow and temperature field in electronic switching systems. These three steps are presented here. First, a numerical method was developed to solve an adequate mathematical model. Second, single row experiments were used jointly with a simple model to establish friction factor and heat transfer correlations. Third, a switching entity mock-up was specially designed to permit detailed air flow and temperature measurements. Different geometrical configurations and thermal power dissipations were experimented to validate the computer code.