ISSN Online: 2377-424X
ISBN Print: 978-1-56700-474-8
ISBN Online: 978-1-56700-473-1
International Heat Transfer Conference 16
LOW MELTING POINT METAL ENABLED PCM HEAT SINK AGAINST HIGH HEAT FLUX THERMAL SHOCK
Abstrakt
In this paper, an internally finned PCM thermal buffering module based on a low melting point metal, gallium, is developed and numerically investigated. Thermal responses of the module under high thermal shock conditions (e.g. 100 W, 25 W/cm2) are studied, in comparison with that of a conventional paraffin PCM. The main parameters characterizing the module, including thermal resistance and temperature rise rate during melting, are evaluated, and corresponding correlations are provided for guiding practical thermal design. Periodic thermal performance of the module under given convection cooling condition is investigated and compared with the case without PCM. The developed low melting point metal based PCM module shows excellent thermal control performance in coping with high heat flux thermal shocks, which is very difficult to handle by conventional organic PCMs.