Abo Bibliothek: Guest

ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

THERMAL MANAGEMENT OF HIGH-POWER TAB 1С CHIPS INCORPORATING HEAT SPREADERS AND HEAT PIPES

Get access (open in a dialog) DOI: 10.1615/IHTC9.460
pages 295-300

Abstrakt

To meet the junction-to-air thermal resistance of 1oC/W at a cooling air velocity of 2.54 m/s (500 ft/min) for a 550-lead TAB IC dissipating 50 W, the thermal packaging design was to bond the chip to a heat spreader attached to a heat pipe. A finite-difference computer program was used to optimize the heat spreader design. The pertinent parameters included thermal conductivity, sizes of the die and heat spreader, and the defined overall heat transfer coefficient for cooling. Results of the computer simulation were compared to the analytical and test data. For designing the specific heat pipe, experiments were performed to investigate various parameters, such as type and amount of the working fluid, wick structure, tilt angle, power input and velocity of the cooling air. Thermal performance of various materials for the die bonding and heat sink attachment was also studied.