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International Heat Transfer Conference 15

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

Comparison between the Thermal Performance of Single and Two-Layer Microchannels Inserted with Micro Pin Fins

Olayinka Omowunmi Adewumi
Department of Mechanical Engineering, University of Lagos, Akoka-Yaba, Lagos, Nigeria

Tunde Bello-Ochende
Department of Mechanical Engineering, University of Cape Town, Cape Town, Private Bag X3, Rondebosch, 7701, South Africa

Josua Petrus Meyer
Department of Mechanical and Aeronautical Engineering, University of Pretoria, Pretoria, Private Bag X20, Hatfield, 0028, South Africa

DOI: 10.1615/IHTC15.hex.009149
pages 3541-3552

KEY WORDS: Heat exchanger, Electronic equipment cooling, Forced convection, Minimized peak temperature, Maximum thermal Conductance, Channel hydraulic diameter, Channel aspect ratio, Solid volume fraction.


This paper presents a three-dimensional numerical study of steady, laminar, incompressible flow and forced convection heat transfer through single and double-layer rectangular stacked microchannel heat sink inserted with pin fins. The objective of the study was to optimise the geometric configuration of the combined single and double-layer stack of microchannel heat sink with micro pin fins for a fixed solid volume so that the peak temperature within the configuration is minimised. The geometric optimisation of the microchannel was carried out using a computational fluid dynamic (CFD) code with a goal driven optimization workbench tool subject to global constraints. Effects of pressure drop on the channel hydraulic diameter, channel aspect ratio, solid volume fraction, minimised peak temperature and maximum thermal conductance for the fixed solid volume were reported. The thermal performance of the single and stacked microchannel heat sink inserted with micro pin fins based on the minimised peak temperature and maximised global thermal conductance were compared and their results were reported.For a constant solid volume of 0.9mm3 and fixed length of 10mm, it was observed that while the performance of the single microchannel was improved with the micro pin fins, it was not the case with the double-layer stack. These results showed that inserting pin fins in a stacked microchannel does not enhance the heat transfer when the length of the solid substrate is fixed. The thermal performance of the combined design when the axial length of the solid substrate was relaxed was also reported.

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