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ISSN Online: 2377-424X

ISBN Print: 0-85295-345-3

International Heat Transfer Conference 10
August, 14-18, 1994, Brighton, UK

HEAT TRANSFER IN ELECTRONIC PACKAGING

Get access (open in a dialog) DOI: 10.1615/IHTC10.5280
pages 93-104

Abstract

The important contact and convection thermal resistances which occur at the numerous interfaces and at the air cooled interfaces in association with microelectronic packaging are considered in this paper. The contact, gap and joint conductance models based on plastic deformation of the contacting asperities are reviewed, and the most recent modifications to the relative contact pressure are presented. The contact conductance model is compared againt data obtained for four different metals, and a wide range of effective surface roughness and surface slope. With the exception of some light load data, the model predictions and the data are in very good agreement.
A recently proposed simple cuboid model is applied to the problem of predicting the heat transfer rates from rectangular heat sinks. The agreement between the model and some data is shown to be in excellent agreement over a range of Rayleigh number corresponding to boundary layer flow over the active heat sink surface.