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THE INFLUENCE OF SUBCOOLING ON THE POOL NUCLEATE BOILING AND CRITICAL HEAT FLUX OF SIMULATED ELECTRONIC CHIPS

R. D. M. Carvalho
Department of Mechanical Engineering, Aeronautical Engineering & Mechanics Rensselaer Polytechnic Institute, Troy, NY 12180-3590, USA

Arthur E. Bergles
Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York; University of Maryland, College Park, Maryland; Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

Abstract

Three commercially available enhanced boiling surfaces (Union Carbide High Flux, Hitachi Thermoexcel−E, and Wieland GEWA−T) and a smooth copper surface were used to reduce the wall superheat and increase the critical heat flux (CHF) of 5mm × 5mm simulated electronic chips. Experiments were performed in a pool of FC−72 at atmospheric pressure under saturated and sub-cooled conditions; the subcooling range was 0−31° C. It was found that particular combinations of enhanced surface and subcooling can provide the heat removal capability required for future high flux chips. Heat fluxes higher than 106W/m2 were obtained. Insight into the influence of subcooling on pool nucleate boiling and CHF is gained.

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