ISSN Online: 2377-424X
International Heat Transfer Conference 12
Thermal constriction phenomena in reversing heat flow systems
Abstract
Thermal constriction phenomena play an essential rôle on temperature distributions and behaviour of complex systems such as ultra-compact electronic circuits. The thermal constriction has been studied under various shapes and boundary conditions by many authors. In this paper, we investigate a novel configuration of the thermal constriction, corresponding to a reversing of the heat flow. The system under consideration is an heat source and an heat sink placed on one of the plane surfaces of a finite insulated cylindrical tube. Investigations have been performed in view to design electronic power systems, more especially for the integration of chips and components on Multi-Chip modules. The paper reports the following points : a description and a presentation of the method set up to solve heat conduction problem and provide the reversal thermal resistance of the system, a sensitivity analysis of the convergence of the solution, as well as the method used for the inversion of the linear system, a validation and a comparison of the solution with the one given by finite element method. The last point presented is a thermal analysis of the reversing heat flow phenomena and a comparison between the reversal
thermal resistance and a traditional resistance, corresponding at two possible implantations of a component.