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International Heat Transfer Conference 6

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)


M. C. Bodea
Polytechnic Institute, Bucharest, Romania

A. P. Silard
Polytechnic Institute, Bucharest, Romania

M. A. Luca
Polytechnic Institute, Bucharest, Romania

N. Marinescu
IPRS-Baneasa, Str.Erou Iancu Nicolae nr.32, Bucharest, Romania

DOI: 10.1615/IHTC6.2910
pages 191-195


A full thermal investigation of the Temperature Stabilized Substrate Integrated Circuit (TSS IC) μA726 has been performed using a new and accurate quasi-three dimensional numerical method. This new method allows a reduction of the three-dimensional thermal problem to a bidimensional one. This reduction do not affect the accuracy of the computed temperature distribution of the semiconductor chip. The validity of our approach was checked experimentally. A good agreement was found between theoretical and experimental data. This method, tested in complete and interactive electrical and thermal analysis of TSS IC μA726 is of a general validity, beeing a valuable tool in electrothermal analysis of other integrated circuits(ICS).

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